M.Watanabe & Co.,Ltd. Launches
"Wacom Flash CVD System''

World-First Ferroelectric Thin Film CVD System, Commercialized for FeRAM-LSI Mass Production

TOKYO--March 6, 2003--M.Watanabe & Co.,Ltd. today announces that its subsidiary, Wacom Electric Co.,Ltd. has completed development of the "Wacom Flash CVD System," the world-first commercialized Ferroelectric Thin Film CVD system enabling mass production of FeRAM-LSIs. The Flash CVD system is a product of the joint development efforts with Dr. Masayuki Toda, Professor of Materials Science & Engineering at Yamagata University. M.Watanabe & Co.,Ltd. will unveil the specifics of the "Wacom Flash CVD System" on March 11th (US time) at ISIF 2003 to be held at Colorado Springs, Colorado, USA. The company plans to have the system available as of March 11 worldwide. Voss electronic GmbH, the long term Partner of M.Watanabe & Co.,Ltd will take over exclusive distribution for Europe.

About the "Wacom Flash CVD System"

The Wacom Flash CVD System is an innovative Ferroelectric Thin Film CVD System that overcomes the difficult FeRAM-LSI volume production problems by appication of CVD technology for ferroelectrics, such as PZT (Lead Zirconate Titanate) and SBT (Strontium Bismuth Tantalate), and thus, permit the mass production of FeRAM-LSIs. The Wacom Flash CVD System will enable the next-generation FeRAM-LSI production technologies to advance significantly. Because it can form other thin films of various compositions such as PZT and SBT, and the flexibility of the technology can also be applied to a broad range of areas other than FeRAMs, such as super conductive oxides.

Features of Wacom Flash CVD System

• Formed thin films: High quality SBT, PZT

• Solution vaporizer: Newly developed clogging-free vaporizer

• Reproducibility, Controllability, Uniformity: Film thickness less than +/- 5% (80nm), Composition less than +/- 5%

• Deposition rate: up to 30nm/min (soon available for 100nm/min)

• Multi. Step Deposition: Easy to apply

• Environmental Protection System (Pb, Bi, etc.)

• Various applications of Flash CVD Technology: Various composition of thin film besides SBT, PZT are available.

Example: Ir, Pt, Cu, TaN, YBCOx (super conducting oxide)

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Principle
The most common use for a IPA VAPOR DRYER is after a cleaning process where the wafers or other substrates are rinsed in a quick dump rinser (QDR) and then transferred into an IPA VAPOR DRYER.

The wafers are either hydrophobic or hydrophilic before entering the IPA. In the Vapor Dryer the DI-Water-Film (which may contain salt crystals) is completely removed down to a molecular level and replaced by IPA. When the wafers first contact the vapor atmosphere, the IPA will migrate to the surface of the wafer, where the temperature is at its lowest point. The IPA will isiotrope (absorb) on the surface and get mixed with the DI-Water. The water enriched IPA will shed off the surface due to the specific gravity differential between Isopropyl Alcohol and DI-Water. Final rinsing will then be done by continued vapor condensation on the surface of the substrate, until it reaches vapor temperature. As IPA has a very low surface tension rating it permeates the wafer topography (line geometry’s) and uniformly covers the surface of the wafers.

Easy Operation
The IPA VAPOR DRYER is easy to operate and offers high flexibility. Operation from the control panel is easy and straightforward. Status and alarm indicators communicate important information to the operator.

Safety
The IPA VAPOR DRYER provides continuous self monitoring. It is designed to monitor a number of parameters and sensor inputs to detect deviation from established processes or limits. Based on these monitored parameters and input sensors, the vapor dryer provides status and alarm indications. Where appropriate, the vapor dryer will immediately generate automatic operations in response to alarms according to the CE standard.

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Lamps for Semiconductor Photolithography